Mask assembly and organic light emitting display device manufactured using the same

ABSTRACT

A mask assembly and an organic light emitting display device manufactured using the mask assembly are capable of realizing an organic light emitting display device having a hole in a display area, the mask assembly including a frame defining a first opening area, a first mask on the frame and defining a plurality of second opening areas that overlap the first opening area, and a second mask fixed to the frame across the plurality of second opening areas, and including a body portion overlapping the first mask, a blocking portion at each respective one of the second opening areas, and a pattern portion between the body portion and the blocking portion, and defining a plurality of holes.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to, and the benefit of, Korean PatentApplication No. 10-2018-0036322, filed on Mar. 29, 2018, in the KoreanIntellectual Property Office (KIPO), the disclosure of which isincorporated by reference herein in its entirety.

BACKGROUND 1. Field

Embodiments of the present invention relate to a mask assembly, and toan organic light emitting display device manufactured using the maskassembly.

2. Discussion of Related Art

Display devices may be classified into liquid crystal display (“LCD”)devices, organic light emitting diode (“OLED”) display devices, plasmadisplay panel (“PDP”) devices, electrophoretic display devices, or thelike based on a light emitting scheme thereof.

Among these, OLED display devices are garnering attention as an idealdisplay device of the next generation because they have excellentdisplay characteristics, such as a contrast ratio and a response time,and are easy to be implemented as flexible display devices.

In general, OLED display devices have a structure in which a cathode andan anode surround several layers of thin films, which includes organicmaterials, on a substrate. Upon applying a voltage to the cathode andthe anode, a current is caused to flow in the organic thin film suchthat a light emission phenomenon may occur. That is, organic moleculesmay be excited to an excited state upon current introduction, and whenthey return to the ground state, the extra energy is emitted as a light.As such, in order to form an OLED display device including a pluralityof organic thin film layers, an organic thin film is deposited over theentire substrate.

The types of masks used in such a deposition process may include a finemetal mask (“FMM”) that is used to perform a precise patterningdepending on a location in a display area of each display device, and anopen mask that is used when forming a common thin film layer over theentire display area. For example, when a deposition material should beprecisely deposited only at a predetermined pixel position in thedisplay area, such as a light emission layer, the fine metal mask isused. On the other hand, when a deposition material should be depositedover the entire display area, such as an electron injection layer, anelectron transporting layer, a hole injection layer, and a holetransporting layer, the open mask whose entire area is open is used.

In recent times, as a display device including a narrow bezel is soughtafter, at least one of a camera hole, a sensor hole, an LED hole, and aspeaker hole may be positioned within the display area of the displaydevice. Accordingly, it may be suitable to manufacture an open maskincluding a pattern corresponding to the hole.

It is to be understood that this background of the technology section isintended to provide useful background for understanding the technology,and as such, information disclosed in the technology background sectionmay include ideas, concepts, or recognitions that were not part of whatwas known or appreciated by those skilled in the pertinent art prior toa corresponding effective filing date of subject matter disclosedherein.

SUMMARY

Embodiments of the present invention may be directed to a mask assemblycapable of realizing an organic light emitting display device having ahole in a display area, and to an organic light emitting display devicemanufactured using the mask assembly.

According to an embodiment, a mask assembly includes a frame defining afirst opening area, a first mask on the frame and defining a pluralityof second opening areas that overlap the first opening area, and asecond mask fixed to the frame across the plurality of second openingareas, and including a body portion overlapping the first mask, ablocking portion at each respective one of the second opening areas, anda pattern portion between the body portion and the blocking portion, anddefining a plurality of holes.

The second mask may extend in a lengthwise direction of the first mask.

The second mask may extend in a widthwise direction of the first mask.

The blocking portion may have a width substantially equal to a width ofthe pattern portion.

The blocking portion and the pattern portion may have an area in a rangefrom about 1% to about 50% of an area of the second opening areas.

The plurality of holes may have an area in a range from about 50% toabout 80% of an area of the pattern portion.

The second mask may have a thickness in a range from about 80 μm toabout 300 μm.

A shape of each of the plurality of holes may include one of a circle,an ellipse, or a polygon on a plane.

The frame may define a groove at a position overlapping the second mask,wherein a shape of the second mask corresponds to being inserted intothe groove.

The second mask may be bent at an end thereof to extend toward a sidesurface of the frame, and may be fixed to the frame.

Each of the first mask and the second mask may include one of stainlesssteel (SUS), an invar alloy, nickel (Ni), cobalt (Co), a nickel alloy,or a nickel-cobalt alloy.

According to an embodiment, an organic light emitting display deviceincludes a substrate having a display area, a first non-display area inthe display area, and a second non-display area around the display area,a plurality of first pixel electrodes on the substrate at the displayarea, a functional member corresponding to the first non-display area,and an organic layer on the first pixel electrode, defining a first holeat the first non-display area, and including an organic pattern portionin the display area and adjacent to the first hole.

The organic pattern portion may have a width substantially equal to awidth of the first hole.

The organic pattern portion may surround the first hole.

The organic pattern portion may have a shape of a circle, an ellipse, ora polygon repeatedly arranged on a plane.

Each of the shapes of the organic pattern portion may overlap one of thefirst pixel electrodes on a plane.

Each of the shapes of the organic pattern portion may overlap two toeight of the first pixel electrodes on a plane.

The organic layer may include one of an electron injection layer, anelectron transporting layer, a hole injection layer, a hole transportinglayer, and an organic light emitting layer.

The organic light emitting display device may further include a secondpixel electrode on the organic layer.

The organic light emitting display device may further include a thinfilm encapsulation layer on the organic layer over an entire surface ofthe substrate.

The foregoing is illustrative only, and is not intended to be in any waylimiting. In addition to the illustrative aspects and embodimentsdescribed above, further aspects and embodiments will become apparent byreference to the drawings, and the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present invention will become moreapparent by describing in detail embodiments thereof with reference tothe accompanying drawings, wherein:

FIG. 1 is an exploded perspective view illustrating a mask assemblyaccording to an embodiment of the present invention;

FIG. 2 is a plan view illustrating a mask assembly according to anembodiment of the present invention;

FIG. 3 is a plan view illustrating a part of a second mask of FIG. 1 andan enlarged view of the second mask;

FIG. 4A is a cross-sectional view taken along the line I-I′ in FIG. 2;

FIG. 4B is a cross-sectional view taken along the line II-I′ in FIG. 2;

FIG. 5 is an exploded perspective view illustrating a mask assemblyaccording to another embodiment of the present invention;

FIG. 6 is a cross-sectional view for explaining a deposition process ofa display device using a mask assembly according to an embodiment of thepresent invention;

FIG. 7 is a plan view schematically illustrating an organic lightemitting display device manufactured using a mask assembly according toan embodiment of the present invention;

FIG. 8 is a cross-sectional view taken along the line A-A′ in FIG. 7;

FIG. 9 is a plan view schematically illustrating an organic layerdeposited using a mask assembly according to an embodiment of thepresent invention;

FIG. 10 is a plan view schematically illustrating an organic layerdeposited using a mask assembly according to another embodiment of thepresent invention;

FIG. 11 is a plan view schematically illustrating an organic layerdeposited using a mask assembly according to still another embodiment ofthe present invention;

FIG. 12 is a plan view schematically illustrating a first pixelelectrode and an organic layer according to an embodiment of the presentinvention; and

FIG. 13 is a plan view schematically illustrating a first pixelelectrode and an organic layer according to another embodiment of thepresent invention.

DETAILED DESCRIPTION

Embodiments will now be described more fully hereinafter with referenceto the accompanying drawings. Although the invention may be modified invarious manners and have several embodiments, embodiments areillustrated in the accompanying drawings and will be mainly described inthe specification. However, the scope of the invention is not limited tothe embodiments and should be construed as including all the changes,equivalents and substitutions included in the spirit and scope of theinvention.

In the drawings, thicknesses of a plurality of layers and areas areillustrated in an enlarged manner for clarity and ease of descriptionthereof. When a layer, area, or plate is referred to as being “on”another layer, area, or plate, it may be directly on the other layer,area, or plate, or intervening layers, areas, or plates may be presenttherebetween. Conversely, when a layer, area, or plate is referred to asbeing “directly on” another layer, area, or plate, intervening layers,areas, or plates may be absent therebetween. Further when a layer, area,or plate is referred to as being “below” another layer, area, or plate,it may be directly below the other layer, area, or plate, or interveninglayers, areas, or plates may be present therebetween. Conversely, when alayer, area, or plate is referred to as being “directly below” anotherlayer, area, or plate, intervening layers, areas, or plates may beabsent therebetween.

The spatially relative terms “below”, “beneath”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe the relations between one element or component and anotherelement or component as illustrated in the drawings. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation, in addition tothe orientation depicted in the drawings. For example, when a deviceillustrated in the drawing is turned over, the device positioned “below”or “beneath” another device may be placed “above” another device.Accordingly, the illustrative term “below” may include both the lowerand upper positions. The device may also be oriented in the otherdirection and thus the spatially relative terms may be interpreteddifferently depending on the orientations.

Throughout the specification, when an element is referred to as being“connected” to another element, the element is “directly connected” tothe other element, or “electrically connected” to the other element withone or more intervening elements interposed therebetween. It will befurther understood that the terms “comprises,” “including,” “includes”and/or “including,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elementsand/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components and/or groups thereof.

It will be understood that, although the terms “first,” “second,”“third,” and the like may be used herein to describe various elements,these elements should not be limited by these terms. These terms areonly used to distinguish one element from another element. Thus, “afirst element” discussed below could be termed “a second element” or “athird element,” and “a second element” and “a third element” may betermed likewise without departing from the teachings herein.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” may mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms used herein (including technical andscientific terms) have the same meaning as commonly understood by thoseskilled in the art to which this invention pertains. It will be furtherunderstood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an ideal or excessively formal sense unlessclearly defined in the present specification.

Some of the parts which are not associated with the description may notbe provided in order to specifically describe embodiments of the presentinvention and like reference numerals refer to like elements throughoutthe specification.

Hereinafter, a mask assembly according to an embodiment of the presentinvention will be described in detail with reference to FIGS. 1 to 3. Asused herein, the term “mask assembly” may refer to, for example, adeposition mask assembly or any other mask assembly used to deposit orplace materials in a desired form or manner.

FIG. 1 is an exploded perspective view illustrating a mask assemblyaccording to an embodiment of the present invention, FIG. 2 is a planview illustrating a mask assembly according to an embodiment of thepresent invention, and FIG. 3 is a plan view illustrating a part of asecond mask of FIG. 1 and an enlarged view of the second mask.

Referring to FIGS. 1 to 3, a mask assembly 10 according to an embodimentof the present invention includes a frame 100, a first mask 200, and asecond mask 300. As used herein, for ease of description, a long sidedirection (e.g., a lengthwise direction) of the frame 100 is referred toas a first direction D1, a short side direction (e.g., a widthwisedirection) of the frame 100 is referred to as a second direction D2, anda thickness direction of the frame 100 is referred to as a thirddirection D3.

The frame 100 defines a first opening area 101 that is located at thecenter of the frame 100. For example, as illustrated in FIG. 1, theframe 100 may have a quadrangular ring shape corresponding to asubstrate that is to undergo deposition, and may have the first openingarea 101 having a quadrangular shape at the center of the frame 100 toperform the deposition process of the substrate.

The frame 100 supports the first mask 200 to be placed thereon. Inaddition, opposite end portions of the second mask 300 to be describedbelow are to be placed and fixed on the frame 100. To this end, at leastpart of the frame 100 may have grooves gr, which will be described indetail below.

The first mask 200 may be, for example, an open mask. The first mask 200is placed on the frame 100. The first mask 200 has a quadrangular plateshape corresponding to the frame 100, for example. The first mask 200may include one of stainless steel (SUS), an invar alloy, nickel (Ni),cobalt (Co), a nickel alloy, and a nickel-cobalt alloy.

The first mask 200 defines a plurality of second opening areas 201. Theplurality of second opening areas 201 are located above the firstopening area 101. In such an embodiment, one second opening area 201corresponds to one display device area. For example, as illustrated inFIG. 1, the first mask 200 according to an embodiment of the presentinvention may have twelve second opening areas 201, and accordingly, thefirst mask 200 may have a size corresponding to twelve display deviceareas (e.g., twelve display device areas respectively corresponding totwelve display devices). However, embodiments are not limited thereto,and the number and size of the second opening areas 201 may bedetermined in consideration of the process conditions of the displaydevice. The deposition material may pass through the first opening area101 and the plurality of second opening areas 201 to be deposited on thesubstrate of the display device(s).

The first mask 200 may be fixed on the frame 100 under a tensile forcein first and second directions D1 and D2. For example, the first mask200 may be fixed on the frame 100 in a welding manner. The welding maybe spot welding. In the spot welding method, a plurality of weldingpoints are set to perform welding for each welding point, and thusdeformation of the first mask 200 during welding may be significantlyreduced. The welding points may be, for example, in the form of at leastone column or zigzag.

As such, the frame 100 may receive a compressive force, which is areaction to the tensile force, in the first and second directions D1 andD2, and the frame 100 may be deformed by heat that may be generatedduring welding. Thus, to substantially reduce or minimize thedeformation due to the compressive force or heat acting on the frame100, the frame 100 includes a metal having high rigidity.

The second mask 300 (which is, for example, an auxiliary mask) islocated on the first mask 200. The second mask 300 has, for example, astick shape, as illustrated in FIG. 1. The second mask 300 may include amaterial substantially the same as a material included in the first mask200.

The second mask 300 is located on the first mask 200 across theplurality of second opening areas 201 arranged along at least onedirection. For example, as illustrated in FIG. 1, a second mask 300according to an embodiment of the present invention may be locatedacross six second opening areas 201 arranged along the first directionD1. Although one second mask 300 is shown in FIG. 1 for ease ofdescription, a plurality of second masks 300 may be located across aplurality of second opening areas 201 arranged along one direction. Asan example, as illustrated in FIG. 1, when twelve second opening areas201 are defined in two columns each including six of the second openingareas 201 arranged along the first direction D1, two second masks 300each located across six of the second opening areas 201 that arearranged along the first direction D1 may be provided. As anotherexample, as illustrated in FIG. 2, when eighteen second opening areas201 are defined in the columns each including six of the second openingareas 201 arranged along the first direction D1, there may be providethree second masks 300 each located across two or more (e.g., six) ofthe second opening areas 201. In addition, opposite end portions of thesecond masks 300 may be fixed to the frame 100 while overlapping theframe 100, which will be described in more detail below.

Referring to FIGS. 1 to 3, the second mask 300 includes a blockingportion 310 located at each of the plurality of second opening areas 201of the first mask 200 corresponding to the second mask 300, a bodyportion 330 overlapping the first mask 200, and a pattern portion 320located between the blocking portion 310 and the body portion 330 andhaving a plurality of holes. That is, one blocking portion 310 and thepattern portions 320 that are located on opposite sides of the oneblocking portion 310 are located in each of the second opening areas 201of the first mask 200.

The blocking portion 310 overlaps a non-display area of a display devicethat is within a display area of the display device, during a depositionprocess forming a common layer of the display device. For example, theblocking portion 310 may correspond to a hole within the display area ofthe display device (e.g., and in the descriptions below with referenceto FIG. 8, the hole H located in a non-display area in the displayarea). In such an embodiment, the hole H may be one of a camera hole, asensor hole, an LED hole, and/or a speaker hole of the display device.

As display devices having a narrow bezel are in demand recently, atleast one of a camera hole, a sensor hole, an LED hole, and/or a speakerhole may be located in the display area of the display device. In suchan embodiment, in the deposition process using a mask, a depositionmaterial should not be deposited in the hole H located in the displayarea. As the mask assembly 10 according to an embodiment of the presentinvention includes the second mask 300 including the blocking portion310, the deposition material may not be deposited in the areacorresponding to the hole H located in the display area.

The blocking portion 310 may have one of a circular shape, an ellipticalshape or a polygonal shape on a plane. For example, as illustrated inFIGS. 1 to 3, the blocking portion 310 may have a quadrangular shape ona plane. However, embodiments are not limited thereto, and the blockingportion 310 may have a shape corresponding to the planar shape of thehole H located in the display area of the display device on a plane. Inaddition, the blocking portion 310 may have a size corresponding to aplanar size of the hole H located in the display area of the displaydevice on a plane. That is, the shape and size of the blocking portion310 on a plane may be determined in consideration of the shape and size,on a plane, of the hole H located in the display area of the displaydevice.

Referring to FIG. 3, the pattern portion 320 has a plurality of holes h.Each of the holes h has a shape of a circle, an ellipse, or a polygon ona plane. For example, as illustrated in FIG. 3, each of the holes h mayhave a rhombic shape on a plane.

The pattern portion 320 overlaps the display area of the display deviceduring the deposition process for forming the common layer of thedisplay device. In the deposition process using the mask assembly 10according to an embodiment of the present invention, the depositionmaterial may be deposited on the substrate of the display device througheach hole h of the pattern portion 320. Accordingly, the depositionmaterial may be deposited on the substrate of the display device havinga planar shape corresponding to the planar shape of each hole h of thepattern portion 320.

In an embodiment, a common layer may be formed in pixels that arearranged on the substrate of the display device in the display area. Insuch an embodiment, the pixel refers to the smallest unit for displayingimages. To this end, the pattern portion 320 is located so that each ofthe holes h of the pattern portion 320 is located on a respective one ormore of the pixels of the display device. As an example, each hole h ofthe pattern portion 320 may overlap one pixel of the display device. Asanother example, each hole h of the pattern portion 320 may overlap two,four, eight, or more pixels. To this end, each hole h of the patternportion 320 has a size corresponding to one, two, four, eight, or morepixels.

In order to stably perform the function of the common layer even thoughthe common layer that has been located over the entire surface of theconventional display devices is formed into a pattern shape, it isdesirable that the pattern portion 320 have a large number of holes hhaving an area as large as possible. However, when the holes h of thepattern portion 320 have an excessively large area, or are too large innumber, the second mask 300 may be cut off, or may break, when thesecond mask 300 is stretched to be fixed on the first mask 200 and theframe 100. On the other hand, when the holes h of the pattern portion320 have a small area or are small in number, the interval between thelight emitting pixels may be widened and the resolution of the displaydevice may be degraded. According to an embodiment of the presentinvention, the total planar area of the holes h of the pattern portion320 may be in the range from about 50% to about 80%. For example, thetotal planar area of the holes h of the pattern portion 320 may be about65% (e.g., about 65% of the entire area of the pattern portion).However, embodiments are not limited thereto, and the number and area ofthe holes h of the pattern portion 320 may be determined inconsideration of process conditions of the display device and resolutionof the display apparatus.

The body portion 330 serves to connect one pattern portion 320 locatedabove one second opening area 201 and another pattern portion 320, whichis adjacent to the one pattern portion 320, located above another secondopening area 201 that is adjacent to the one second opening area 201.

As illustrated in FIG. 1, the second mask 300 may have a thickness dl inthe range from about 80 μm to about 300 μm in the third direction D3.For example, the second mask 300 may have a thickness dl of about 100μm. When the thickness dl of the second mask 300 is less than about 80μm, the second mask 300 that is in the form of a stick and that includesthe pattern portion 320 having a plurality of holes h may be cut off, ormay break, when the second mask 300 is stretched to be fixed on thefirst mask 200 and the frame 100. On the other hand, when the thicknessdl of the second mask 300 is more than about 300 μm, an additionalshadow phenomenon may occur, and the precision of the deposition may bedegraded. However, the thickness dl of the second mask 300 is notlimited to the above range, and may be determined in consideration ofthe durability of the mask and the precision of deposition.

Referring to FIG. 3, a width w1 of the blocking portion 310 issubstantially equal to a width w2 of the pattern portion 320. Inaddition, the width w1 of the blocking portion 310 is substantiallyequal to a width w3 of the body portion 330. In such an embodiment, thewidth w1 of the blocking portion 310, the width w2 of the patternportion 320, and the width w3 of the body portion 330 each refer to awidth in the direction perpendicular to a long side direction of thesecond mask 300. For example, as illustrated in FIG. 1, in an embodimentof the present invention, when the second mask 300 is located across theplurality of second opening areas 201 along the long side direction ofthe opening mask 200, the width w1 of the blocking portion 310, thewidth w2 of the pattern portion 320, and the width w3 of the bodyportion 330 are substantially equal to each other in the seconddirection D2. When the widths w2 and w3 of the pattern portion 320 andthe body portion 330 are less than the width w1 of the blocking portion310, the second mask 300 that is in the form of a stick and thatincludes the pattern portion 320 having a plurality of holes h may becut off or may break when the second mask 300 is stretched to be fixedon the first mask 200 and the frame 100. On the other hand, when thewidth w2 of the pattern portion 320 is greater than the width w1 of theblocking portion 310, the manufacturing costs of the second mask 300 mayunnecessarily increase. However, embodiments of the present inventionare not limited thereto, and the widths w2 and w3 of the pattern portion320 and the body portion 330 may be determined in consideration of thedurability of the mask and the manufacturing costs, and may be differentfrom the width w1 of the blocking portion 310.

As described above, as the blocking portion 310 has the sizecorresponding to the hole H located in the display area of the displaydevice, and as the width w1 of the blocking portion 310 is substantiallyequal to the width w2 of the pattern portion 320 in the second directionD2, each of the blocking portion 310 and the pattern portion 320 islocated in a partial area of the second opening area 201. For example,according to an embodiment of the present invention, when the secondmask 300 is located across the plurality of second opening areas 201arranged along the first direction D1, that is, along the long sidedirection of the first mask 200, the total area of the blocking portion310 and the pattern portion 320 located at the second opening area 201may be in a range from about 1% to about 20% of the total area of thesecond opening area 201 on a plane.

Although the second mask 300 according to an embodiment of the presentinvention is shown as being separated from the first mask 200,embodiments are not limited thereto. In an embodiment, the second mask300 and the first mask 200 may be integrally formed into a unitarystructure.

Hereinafter, the groove gr of the frame 100 will be described withreference to FIGS. 1, 2, 4A, and 4B. FIG. 4A is a cross-sectional viewtaken along the line I-I′ in FIG. 2, and FIG. 4B is a cross-sectionalview taken along the line II-I′ in FIG. 2.

The frame 100 may have the groove gr at a portion of the frame 100 thatoverlaps the second mask 300. For example, as illustrated in FIG. 1,when the second mask 300 is located across the plurality of secondopening areas 201 arranged along the first direction D1, the groove grmay be defined in each of opposite sides of an upper surface of theframe 100 that extend along the second direction D2. That is, when thesecond mask 300 is located extending along the long side direction ofthe frame 100, the groove gr may be defined on the upper surface of theframe 100 in the short side direction of the frame 100.

The groove gr of the frame 100 may be defined in the form correspondingto the shape of a portion of the second mask 300 that overlaps thegroove gr. For example, as illustrated in FIG. 4A, the cross-section ofthe groove gr of the frame 100 may have a quadrangular shape. However,embodiments are not limited thereto, and the groove gr of the frame 100may have various shapes that may fasten the second mask 300.

The second mask 300 may be inserted into the groove gr of the frame 100.For example, as illustrated in FIG. 4B, the second mask 300 may be bentto pass along the side surface of the first mask 200 to be inserted intothe groove gr of the frame 100. In addition, the second mask 300 may bewelded to the groove gr of the frame 100 and fixed thereto.

Hereinafter, a mask assembly 20 according to another embodiment of thepresent invention will be described with reference to FIG. 5. FIG. 5 isan exploded perspective view illustrating a mask assembly according toanother embodiment of the present invention. Repeated description of thecomponents of previously described embodiments that are the same asthose according to the present embodiment is omitted from thedescription to avoid duplication.

Referring to FIG. 5, a mask assembly 20 according to another embodimentof the present invention includes a frame 100, a first mask 200, and asecond mask 300.

The second mask 300 is located on the first mask 200 across a pluralityof second opening areas 201 arranged along at least one direction. Forexample, as illustrated in FIG. 5, a second mask 300 according to thepresent embodiment may be located across two of the second opening areas201 arranged along the second direction D2. Although one second mask 300is shown in FIG. 5 for ease of description, a plurality of second masks300 may be located across a plurality of second opening areas 201arranged along one direction. As an example, as illustrated in FIG. 5,when twelve second opening areas 201 are defined in two columns, eachcolumn including six of the second opening areas 201 arranged along thefirst direction D1, six second masks 300 each located across two of thesecond opening areas 201 that are arranged along the second direction D2may be provided.

The second mask 300 includes a respective blocking portion 310 locatedin each of the plurality of second opening areas 201 of the first mask200, a body portion 330 overlapping the first mask 200, and a patternportion 320 located between the blocking portion 310 and the bodyportion 330 and having a plurality of holes. As described hereinabove,as the blocking portion 310 has the size corresponding to the hole Hlocated in the display area of the display device, and as the width ofthe blocking portion 310 is substantially equal to the width of thepattern portion 320 in the first direction, each of the blocking portion310 and the pattern portion 320 is located in a partial area of thesecond opening area 201. For example, according to another embodiment ofthe present invention, when the second mask 300 is located in the seconddirection D2, that is, across the plurality of second opening areas 201arranged along the short side direction of the first mask 200, the totalarea of the blocking portion 310 and the pattern portion 320 located atthe second opening area 201 may be in the range from about 1% to about50% of the total area of the second opening area 201 on a plane.

The frame 100 may have the groove gr at a portion of the frame 100 thatoverlaps the second mask 300. For example, as illustrated in FIG. 5,when the second mask 300 is located across the plurality of secondopening areas 201 arranged along the second direction D2, the groove gr(e.g., a plurality of grooves gr) may be defined in opposite sides of anupper surface of the frame 100 that extend along the first direction D1.That is, when the second mask 300 extends along the short side directionof the frame 100, the groove gr may be defined on the upper surface ofthe frame 100 in the long side direction of the frame 100.

Hereinafter, a mask assembly according to still another embodiment ofthe present invention will be described. The mask assembly of thepresent embodiment includes a frame having a first opening area and apattern mask located on the frame. The pattern mask includes a pluralityof opening patterns located above the first opening area, and each ofthe plurality of opening patterns corresponds to one display devicearea. Each of the opening patterns includes a blocking portioncorresponding to a hole located in a display area of a display device,and includes a pattern portion over the entire surface except theblocking portion. The pattern portion has a plurality of holes, and eachof the holes may have a shape of a circle, an ellipse, and a polygon ona plane. Because the mask assembly according to the present embodimentincludes the blocking portion and the pattern portion, the displaydevice including a common layer corresponding to pixels in the displayarea and having a hole in the display area may be manufactured.

Hereinafter, a deposition process of a display device using a maskassembly according to an embodiment of the present invention will bedescribed in detail with reference to FIG. 6. FIG. 6 is across-sectional view for explaining a deposition process of a displaydevice using a mask assembly according to an embodiment of the presentinvention.

Referring to FIG. 6, a deposition apparatus according to an embodimentincludes a mask assembly 10, a magnet unit 420, a fastening member 430,a deposition source 440, and a chamber 450.

The mask assembly 10 includes a frame 100, a first mask 200, and asecond mask 300, and is located at an upper portion of, and within, thechamber 450 to face the deposition source 440.

The magnet unit 420 opposes the mask assembly 10 with the substrate Sthat is to undergo the deposition process interposed therebetween. Thesecond mask 300 of the mask assembly 10 may be brought into closecontact with the substrate S by a magnetic force from the magnet unit420.

The fastening member 430 supports edges of the mask assembly 10. Thefastening member 430 is located outside a movement path of thedeposition material supplied from the deposition source 440 to thesubstrate S.

The deposition source 440 is located below the mask assembly 10. Thedeposition source 440 supplies the deposition material to the substrateS through the second opening area 201 of the first mask 200 and theplurality of holes h of the pattern portion 320 of the second mask 300.That is, the deposition material is supplied toward a deposition surfaceof the substrate S positioned at an upper portion of the inside of thechamber 450.

The deposition source 440 may be in the form of a crucible including adeposition material therein, and may vaporize the deposition material byheat to be deposited on the substrate S. The deposition processapparatus may further include a heater for heating the depositionmaterial. The heater may be provided on opposite sides of the depositionsource 440 to heat the deposition source 440, thereby heating andvaporizing the deposition material accommodated in the deposition source440.

The chamber 450 provides a space in which the deposition processproceeds. The chamber 450 is connected to a vacuum pump, such as a turbomolecular pump (TMP), so that the inside of the chamber 450 may bemaintained in a vacuum state during the deposition process. The chamber450 may further include a deposition prevention plate surrounding aninner wall surface of the chamber 450. The deposition prevention platereduces or substantially prevents a deposition material that is notdeposited on the substrate S among the deposition materials sprayed fromthe deposition source 440 from being adsorbed on the inner wall surfaceof the chamber 450.

The substrate S is located on the mask assembly 10. The substrate S maybe located so as to overlap the first opening area 101 of the maskassembly 10.

The deposition process apparatus may further include a thicknessmonitoring sensor for measuring a velocity of the deposition materialand/or a thickness of the deposition material (e.g., on the substrate),a thickness controller for controlling the deposition source 440according to the measured thickness, a shutter for blocking thedeposition material vaporized from the deposition source 440, and thelike. In addition, the deposition process apparatus may further includean aligner and a CCD camera located outside the chamber 450 for aligningthe substrate S with the mask assembly 10.

Hereinafter, a process of depositing a deposition material on thedeposition surface of the substrate S will be described.

First, the mask assembly 10 is fastened to the fastening member 430, andthe substrate S is placed above the second mask 300.

Subsequently, the deposition source 440 located at a lower portion ofthe interior of the chamber 450 ejects the deposition material towardthe mask assembly 10. For example, when a power is applied to a heaterconnected to the deposition source 440, the deposition source 440accommodating the deposition material is heated, whereby the depositionmaterial is heated and vaporized to be sprayed toward the mask assembly10. In such an embodiment, the inside of the chamber 450 is maintainedat a high degree of vacuum and a high temperature.

When the deposition material is sprayed, the deposition material isdeposited over the deposition surface of the substrate S through thesecond opening area 201 of the first mask 200 and through the pluralityof holes h of the pattern portion 320 of the second mask 300. In such anembodiment, because the mask assembly 10 according to the presentembodiment includes the second mask 300 that includes the blockingportion 310 and the pattern portion 320, the deposition material is notdeposited on a portion of the substrate S corresponding to the blockingportion 310, the deposition material is deposited into a pattern shapeon a portion of the substrate S corresponding to the pattern portion320, the deposition material is deposited over the entire surface of thesubstrate S corresponding to the second opening area 201 except areascorresponding to the blocking portion 310 and the pattern portion 320,and a common layer may be formed on the substrate S accordingly.

In detail, because the second mask 300 includes the blocking portion 310that corresponds to one hole located in the non-display area that iswithin the display area of the display device, the deposition material,therefore, may not be deposited in the area of the substrate Scorresponding to the hole during the deposition process. In addition, asthe second mask 300 includes the pattern portion 320 locatedcorresponding to the display area of the display device, the depositionmaterial may be deposited during the deposition process on an area ofthe substrate S corresponding to the pattern portion 320 into a planarshape corresponding to the planar shape of the plurality of holes h ofthe pattern portion 320.

According to an embodiment of the present invention, the second mask 300may closely contact the substrate S. Accordingly, the depositionmaterial may not be deposited on the area of the substrate Scorresponding to the blocking portion 310, and the deposition materialmay be deposited into a precise pattern on the area of the substrate Scorresponding to the pattern portion 320.

Hereinafter, an organic light emitting display device manufactured usingthe mask assembly 10 according to an embodiment will be described withreference to FIGS. 7 and 8.

FIG. 7 is a plan view schematically illustrating an organic lightemitting display device (hereinafter, “organic light emitting diode(“OLED”) display device”) manufactured using a mask assembly accordingto an embodiment of the present invention, and FIG. 8 is across-sectional view taken along the line A-A′ in FIG. 7.

Referring to FIG. 7, the OLED display device according to an embodimentof the present invention includes a display area DA for displayingimages, a first non-display area NDA1 located in the display area DA,and a second non-display area NDA2 located around the display area DA.

The OLED display device according to an embodiment of the presentinvention includes a functional member located at the first non-displayarea NDA1. For example, the OLED display device may have a hole Hlocated at the first non-display area NDA1, and the functional membermay be located in the hole H. In such an embodiment, the functionalmember may be a camera, a sensor, an LED, a speaker, and/or the like.

FIG. 8 schematically shows a cross-section of a part of the hole H andone pixel located adjacent to the hole H in the first non-display areaNDA1. Referring to FIG. 8, an OLED display device according to anembodiment of the present invention includes a substrate 510, a bufferlayer 520, a wiring unit 530, a gate insulating layer 540, a thin filmtransistor (“TFT”), a capacitor 80, a first pixel electrode 611, anorganic light emitting layer 612, a second pixel electrode 613, anorganic layer 630, a thin film encapsulation layer 650, and the like.

The substrate 510 may include an insulating material of glass, quartz,ceramic, plastic, or the like. However, embodiments are not limitedthereto, and the substrate 510 according to an embodiment may include ametallic material such as stainless steel.

The buffer layer 520 is located on the substrate 510. The buffer layer520 may include one or more layers selected from various inorganiclayers and organic layers. The buffer layer 520 serves to reduce orsubstantially prevent permeation of undesirable elements, such asimpurities or moisture, into the wiring unit 530 or the OLED, and toplanarize a surface therebelow. However, the buffer layer 520 is notinvariably necessary, and may be omitted according to the type andprocess conditions of the substrate 510.

The wiring unit 530 is located on the buffer layer 520. The wiring unit530 corresponds to a portion including a switching thin film transistor(“TFT”), a driving TFT 50, and a capacitor 80. The wiring unit 530drives the OLED. The OLED emits light according to a driving signalreceived from the wiring unit 530 to display images.

Each pixel may include two TFTs and one capacitor, but embodiments arenot limited thereto. For example, each pixel of the OLED display devicemay include three or more TFTs and two or more capacitors, and mayfurther include additional wirings. Herein, the term “pixel” refers to asmallest unit for displaying images, and the OLED display devicedisplays images using a plurality of pixels.

The switching TFT, the driving TFT 50, the capacitor 80, and the OLEDare provided in each pixel PX. In addition, a gate line located alongone direction, and a data line and a common power line insulated fromand crossing the gate line, are located in the wiring unit 530. Onepixel may be defined by a gate line, a data line, and a common powerline, but embodiments are not limited thereto. Pixels may be defined bya pixel defining layer 590 or by a black matrix.

The OLED includes a plurality of first pixel electrodes 611 located onthe substrate 510, an organic light emitting layer 612 located on theplurality of first pixel electrodes 611, and a second pixel electrode613 located on the organic light emitting layer 612. Holes and electronsare injected into the organic light emitting layer 612 from theplurality of first pixel electrodes 611 and the second pixel electrode613, respectively. When the excitons formed by the injection of theinjected holes and electrons fall from the excited state to the groundstate, light emission occurs. According to an embodiment of the presentinvention, the first pixel electrode 611 may be located in each of thepixels described above. That is, one first pixel electrode 611 may belocated corresponding to one pixel.

The capacitor 80 includes a pair of capacitor plates 558 and 578 with aninsulating interlayer 545 interposed therebetween. In such anembodiment, the insulating interlayer 545 may be a dielectric element. Acapacitance of the capacitor 80 may be determined by electric chargesaccumulated in the capacitor 80 and a voltage between the pair ofcapacitor plates 558 and 578.

The switching TFT includes a switching semiconductor layer, a switchinggate electrode, a switching source electrode, and a switching drainelectrode. The driving TFT 50 includes a driving semiconductor layer532, a driving gate electrode 555, a driving source electrode 576, and adriving drain electrode 577. The semiconductor layers and the gateelectrodes are insulated by the gate insulating layer 540.

The switching TFT may function as a switching element that selects apixel to perform light emission. The switching gate electrode isconnected to the gate line, and the switching source electrode isconnected to the data line. Spaced apart from the switching sourceelectrode, the switching drain electrode is connected to one of thecapacitor plates, e.g., the capacitor plate 558.

The driving TFT 50 applies, to a first pixel electrode 611, a drivingpower that allows the light emitting layer 612 of the OLED in theselected pixel to emit light. The driving gate electrode 555 isconnected to the one capacitor plate 558 that is connected to theswitching drain electrode. Each of the driving source electrode 576 andthe other of the capacitor plates (e.g., the capacitor plate 578) isconnected to the common power line. The driving drain electrode 577 isconnected to the first pixel electrode 611 of the OLED through a contacthole.

With the above-described structure, the switching TFT is driven based ona gate voltage applied to the gate line, and serves to transmit a datavoltage applied to the data line to the driving TFT 50. A voltage thatis equivalent to a difference between a common voltage applied to thedriving TFT 50 from the common power line and the data voltagetransmitted by (or from) the switching TFT is stored in the capacitor80, and a current corresponding to the voltage stored in the capacitor80 flows to the OLED through the driving TFT 50 such that the OLED mayemit light.

In an embodiment, the first pixel electrode 611 is an anode forinjecting holes, and the second pixel electrode 613 is a cathode forinjecting electrons. However, embodiments are not limited thereto, andthe first pixel electrode 611 may be a cathode, and the second pixelelectrode 613 may be an anode.

A planarization layer 546 is located on the insulating interlayer 545.The planarization layer 546 includes an insulating material and protectsthe wiring unit 530. The planarization layer 546 and the insulatinginterlayer 545 may include substantially the same material.

The drain electrode 577 of the driving thin film transistor 20 isconnected to the first pixel electrode 611 of the OLED through a contacthole defined in the planarization layer 546.

According to an embodiment, the first pixel electrode 611 may be areflective electrode, and the second pixel electrode 613 may be atransflective electrode. Accordingly, a light generated in the lightemitting layer 612 is emitted through the second pixel electrode 613.That is, the display device according to an embodiment of the presentinvention may have a top emission type structure.

The reflective layer and the transflective electrode may include one ormore metals of: magnesium (Mg), silver (Ag), gold (Au), calcium (Ca),lithium (Li), chromium (Cr), copper (Cu) and aluminum (Al), or an alloythereof.

For example, the first pixel electrode 611 may include a reflectivelayer including one or more metals of: magnesium (Mg), silver (Ag), gold(Au), calcium (Ca), lithium (Li), chromium (Cr), copper (Cu) andaluminum (Al), and a transparent conductive layer on the reflectivelayer. In addition, the first pixel electrode 611 may have atriple-layer structure in which a transparent conductive layer, areflective layer and a transparent conductive layer are sequentiallystacked.

The second pixel electrode 613 may include a transflective layerincluding one or more metals of: magnesium (Mg), silver (Ag), gold (Au),calcium (Ca), lithium (Li), chromium (Cr), copper (Cu) and aluminum(Al).

The organic light emitting layer 612 may include a monomer or polymerorganic material. The organic light emitting layer 612 may be formed bya known method using a known organic light emitting material.

The pixel defining layer 590 is located between respective ones of theplurality of first pixel electrodes 611. That is, the pixel defininglayer 590 defines an opening exposing at least a part of the first pixelelectrode 611. The first pixel electrode 611, the organic light emittinglayer 612, and the second pixel electrode 613 are sequentially stackedin the opening of the pixel defining layer 590 in the order listed. Thesecond pixel electrode 613 is located on the pixel defining layer 590 aswell as on the organic light emitting layer 612, but embodiments are notlimited thereto. The OLED generates light in the organic light emittinglayer 612 located in the opening of the pixel defining layer 590. Asdescribed above, the light emitting area may be defined by the pixeldefining layer 590.

The organic layer 630 includes a first organic layer 631 between thefirst pixel electrode 611 and the organic light emitting layer 612, anda second organic layer 632 located between the organic light emittinglayer 612 and the second pixel electrode 613.

The organic layer 630 may include an organic material (e.g., a monomeror polymer organic material).

The first organic layer 631 may include at least one of a hole injectionlayer (HIL) and a hole transporting layer (HTL). In addition, the firstorganic layer 631 may include both of the hole injection layer (HIL) andthe hole transporting layer (HTL).

The second organic layer 632 may include at least one of an electrontransporting layer (ETL) and an electron injection layer (EIL). Inaddition, the second organic layer 632 may include both of the electroninjection layer (EIL) and the electron transporting layer (ETL).

The OLED according to an embodiment of the present invention may includeonly one of the first organic layer 631 and the second organic layer632, or may include both of the first organic layer 631 and the secondorganic layer 632.

According to an embodiment of the invention, the organic layer 630 maybe formed having a pattern. The structure of the organic layer 630 willbe described in more detail below with reference to FIGS. 9 to 13.

The thin film encapsulation layer 650 is located on the second pixelelectrode 613. The thin film encapsulation layer 650 includes at leastone inorganic layer 651 and 653 and at least one organic layer 652,which are alternately located. In FIG. 8, the thin film encapsulationlayer 650 includes two inorganic layers 651 and 653 and one organiclayer 652, but embodiments are not limited thereto.

Each of the inorganic layers 651 and 653 may include one or moreinorganic materials of: Al₂O₃, TiO₂, ZrO, SiO₂, AlON, AlN, SiON, Si₃N₄,ZnO and/or Ta₂O₅. The organic layer 652 may include a polymer-basedmaterial. Examples of the polymer-based material may include, forexample, an acrylic resin, an epoxy resin, polyimide, and polyethylene.

The inorganic layers 651 and 653, which have a high density and arerelatively thin, may prevent or efficiently reduce infiltration of,mostly, moisture or oxygen. Permeation of moisture and oxygen into theOLED may be largely reduced or prevented by the inorganic layers 651 and653. The moisture and oxygen that have passed through the inorganiclayers 651 and 653 are blocked again by the organic layer 652. Theorganic layer 652 has a smaller effect of preventing moisture permeationthan the inorganic layers 651 and 653. However, the organic layer 652may also serve as a buffer layer to reduce stress among respective onesof the inorganic layers 651 and 653, in addition to themoisture-permeation preventing function. In addition, because theorganic layer 652 has planarizing characteristics, an uppermost surfaceof the thin film encapsulation layer 650 may be planarized.

Hereinafter, the organic layer 630 according to an embodiment of thepresent invention will be described in detail with reference to FIGS. 9to 11.

FIG. 9 is a plan view schematically illustrating an organic layerdeposited using a mask assembly according to an embodiment of thepresent invention.

The organic layer 630 according to an embodiment of the presentinvention includes a first hole H1 located corresponding to the hole Hin the first non-display area NDA1 of the display device, and an organicpattern portion PA1 located in the display area DA of the display deviceadjacent to the first hole H1. In addition, the organic layer 630 islocated over the entire surface of the substrate in the display area DAexcept for the area where the organic pattern PA1 is located.

The organic pattern portion PA1 may be located adjacent to the firsthole H1 and along at least one side of a long side or a short side ofthe display device. For example, as illustrated in FIG. 9, the organicpattern portion PA1 may be located parallel to the short side of thedisplay device.

The organic pattern portion PA1 may have a width that is substantiallyequal to a width of the first hole H1. For example, as illustrated inFIG. 9, when the organic pattern portion PA1 is located along the shortside of the display device, a width W1 of the first hole H1 issubstantially equal to a width W3 of the organic pattern portion PA1. Insuch an embodiment, the widths W1 and W3 of the first hole H1 and theorganic pattern portion PA1 refer to the width in the long sidedirection of the display device. However, embodiments are not limitedthereto, and the width W1 of the first hole H1 may be different from thewidth W3 of the organic pattern portion PA1 depending on the processconditions of the display device.

The organic pattern portion PA1 may be in the form in which one ofshapes of a circle, an ellipse, or a polygon is repeatedly arranged on aplane. For example, as illustrated in FIG. 9, the organic patternportion PA1 may be in the form in which rhombic shapes are repeatedlyarranged.

In such an embodiment, when the organic layer 630 is formed using themask assembly 10 according to an embodiment of the present invention,the first hole H1 of the organic layer 630 may be defined in thelocation, and may have a planar shape corresponding to those of theblocking portion 310 of the second mask 300, the organic pattern portionPA1 of the organic layer 630 may be formed in the location correspondingto the pattern portion 320 of the second mask 300, and each of theshapes of the organic pattern portion PA1 may be formed in the locationof, and may have a planar shape corresponding to, those of the hole h ofthe pattern portion 320 of the second mask 300.

FIG. 10 is a plan view schematically illustrating an organic layer 630deposited using a mask assembly 20 according to another embodiment ofthe present invention.

The organic layer 630 according to the present embodiment includes afirst hole H1 located corresponding to the hole H in the firstnon-display area NDA1 of the display device, and an organic patternportion PA2 located in the display area DA of the display deviceadjacent to the first hole H1. In addition, the organic layer 630 islocated over the entire surface of the substrate in the display area DAexcept for the area where the organic pattern PA2 is located.

The organic pattern portion PA2 may be located adjacent to the firsthole H1 and along at least one side of a long side or a short side ofthe display device. For example, as illustrated in FIG. 10, the organicpattern portion PA2 may be located parallel to the long side of thedisplay device.

The organic pattern portion PA2 may have a width substantially equal toa width of the first hole H1. For example, as illustrated in FIG. 10,when the organic pattern portion PA2 is located along the long side ofthe display device, a width W2 of the first hole H1 is substantiallyequal to a width W4 of the organic pattern portion PA2. In such anembodiment, the widths W2 and W4 of the first hole H1 and the organicpattern portion PA2 refer to the width in the short side direction ofthe display device. However, embodiments are not limited thereto, andthe width W2 of the first hole H1 may be different from the width W4 ofthe organic pattern portion PA2 depending on the process conditions ofthe display device.

The organic pattern portion PA2 may be in the form in which one ofshapes of a circle, an ellipse, or a polygon is repeatedly arranged on aplane. For example, as illustrated in FIG. 10, the organic patternportion PA2 may be in the form in which rhombic shapes are repeatedlyarranged.

In such an embodiment, when the organic layer 630 is formed using themask assembly 20 according to another embodiment of the presentinvention, the first hole H1 of the organic layer 630 may be defined inthe location of, and may have a planar shape corresponding to, those ofthe blocking portion 310 of the second mask 300, the organic patternportion PA2 of the organic layer 630 may be formed in the locationcorresponding to the pattern portion 320 of the second mask 300, andeach of the shapes of the organic pattern portion PA2 may be formed inthe location of, and may have a planar shape corresponding to, those ofthe hole h of the pattern portion 320 of the second mask 300.

FIG. 11 is a plan view schematically illustrating an organic layerdeposited using a mask assembly according to still another embodiment ofthe present invention.

The organic layer 630 according to still another embodiment of thepresent invention includes a first hole H1 located corresponding to thehole H in the first non-display area NDA1 of the display device, and anorganic pattern portion PA3 located in the display area DA of thedisplay device and surrounding the first hole H1. That is, the organicpattern portion PA3 is located over the entire surface of the substratein the display area DA.

The organic pattern portion PA3 may be in the form in which one ofshapes of a circle, an ellipse, or a polygon is repeatedly arranged on aplane. For example, as illustrated in FIG. 12, the organic patternportion PA3 may be in the form in which rhombic shapes are repeatedlyarranged.

In such an embodiment, when the organic layer 630 is formed using themask assembly according to still another embodiment of the presentinvention, the first hole H1 of the organic layer 630 may be defined inthe location of, and may have a planar shape corresponding to, those ofthe blocking portion of the pattern mask. Also, the organic patternportion PA3 of the organic layer 630 may be formed in the locationcorresponding to the pattern portion of the pattern mask, and each ofthe shapes of the organic pattern portion PA3 may be formed in thelocation of, and may have a planar shape corresponding to, those of thehole of the pattern portion of the pattern mask.

In an embodiment, as another embodiment, the organic light emittinglayer 612 may be located in the same structure as the organic layer 630as described hereinabove with reference to FIGS. 9 to 11. That is, theorganic light emitting layer 612 may also have a hole located in thefirst non-display area NDA1 of the display device, and may include apattern portion having substantially the same shape as the organicpattern portions PA1, PA2, and PA3 of the organic layer 630 describedabove.

Although not illustrated, an organic layer or an inorganic layer thatprotects the OLED and helps the light emitted from the organic lightemitting layer 612 to be efficiently emitted to the outside may befurther located on the second pixel electrode 613 of the OLED displaydevice. Such an organic layer or inorganic layer may be located in thesame structure as the organic layer 630 as described above withreference to FIGS. 9 to 11. That is, such an organic layer or inorganiclayer may also have a hole located in the first non-display area NDA1 ofthe display device, and may include a pattern portion havingsubstantially the same shape as the organic pattern portions PA1, PA2,or PA3 of the organic layer 630 described above.

Hereinafter, the first pixel electrode 611 and the organic layer 630will be described in detail with reference to FIGS. 12 and 13.

FIG. 12 is a plan view schematically illustrating a first pixelelectrode and an organic layer according to an embodiment of the presentinvention, and FIG. 13 is a plan view schematically illustrating a firstpixel electrode and an organic layer according to another embodiment ofthe present invention.

When the organic layer 630 includes the organic pattern portion in whichthe polygonal shape is repeatedly arranged as described with referenceto FIGS. 9 to 11, each repeated polygonal shape of the organic patternportion may overlap the pixel located at the display area of thesubstrate. For example, each shape of the organic pattern portion mayoverlap the first pixel electrode 611 that is located in each pixel.

According to an embodiment of the present invention, each of the shapesof the organic pattern portion of the organic layer 630 may overlap oneof the first pixel electrodes 611 on a plane. For example, asillustrated in FIG. 12, each of the shapes of the organic patternportion of the organic layer 630 is octagonal on a plane, and mayoverlap one first pixel electrode 611.

According to another embodiment of the present invention, each of theshapes of the organic pattern portion of the organic layer 630 mayoverlap two, four, eight, or more first pixel electrodes 611 on a plane.For example, as illustrated in FIG. 13, each of the shapes of theorganic pattern portion of the organic layer 630 is quadrangular on aplane, and may overlap four first pixel electrodes 611.

However, embodiments are not limited thereto, and the size of the shapesof the organic pattern portion of the organic layer 630 and the numberof the first pixel electrodes 611 each shape of the organic patternportion overlaps may be determined in consideration of the processconditions and resolution of the display device.

As set forth hereinabove, according to one or more embodiments, by usingthe mask assembly including the second mask that includes the lightblocking portion and the pattern portion, the OLED display device havinga hole in a display area may be manufactured.

While the present invention has been illustrated, and described withreference to the embodiments thereof, it will be apparent to those ofordinary skill in the art that various changes in form, and detail maybe formed thereto without departing from the spirit, and scope of thepresent invention.

What is claimed is:
 1. A mask assembly comprising: a frame defining afirst opening area; a first mask on the frame and defining a pluralityof second opening areas that overlap the first opening area; and asecond mask fixed to the frame across the plurality of second openingareas, and comprising: a body portion overlapping the first mask; ablocking portion at each respective one of the second opening areas; anda pattern portion between the body portion and the blocking portion, anddefining a plurality of holes.
 2. The mask assembly of claim 1, whereinthe second mask extends in a lengthwise direction of the first mask. 3.The mask assembly of claim 1, wherein the second mask extends in awidthwise direction of the first mask.
 4. The mask assembly of claim 1,wherein the blocking portion has a width substantially equal to a widthof the pattern portion.
 5. The mask assembly of claim 1, wherein theblocking portion and the pattern portion have an area in a range fromabout 1% to about 50% of an area of the second opening areas.
 6. Themask assembly of claim 1, wherein the plurality of holes have an area ina range from about 50% to about 80% of an area of the pattern portion.7. The mask assembly of claim 1, wherein the second mask has a thicknessin a range from about 80 μm to about 300 μm.
 8. The mask assembly ofclaim 1, wherein a shape of each of the plurality of holes comprises oneof a circle, an ellipse, or a polygon on a plane.
 9. The mask assemblyof claim 1, wherein the frame defines a groove at a position overlappingthe second mask, and wherein a shape of the second mask corresponds tobeing inserted into the groove.
 10. The mask assembly of claim 1,wherein the second mask is bent at an end thereof to extend toward aside surface of the frame, and is fixed to the frame.
 11. The maskassembly of claim 1, wherein each of the first mask and the second maskcomprises one of stainless steel (SUS), an invar alloy, nickel (Ni),cobalt (Co), a nickel alloy, or a nickel-cobalt alloy.
 12. An organiclight emitting display device comprising: a substrate having a displayarea, a first non-display area in the display area, and a secondnon-display area around the display area; a plurality of first pixelelectrodes on the substrate at the display area; a functional membercorresponding to the first non-display area; and an organic layer on thefirst pixel electrode, defining a first hole at the first non-displayarea, and comprising an organic pattern portion in the display area andadjacent to the first hole.
 13. The organic light emitting displaydevice of claim 12, wherein the organic pattern portion has a widthsubstantially equal to a width of the first hole.
 14. The organic lightemitting display device of claim 12, wherein the organic pattern portionsurrounds the first hole.
 15. The organic light emitting display deviceof claim 12, wherein the organic pattern portion has a shape of acircle, an ellipse, or a polygon repeatedly arranged on a plane.
 16. Theorganic light emitting display device of claim 15, wherein each of theshapes of the organic pattern portion overlaps one of the first pixelelectrodes on a plane.
 17. The organic light emitting display device ofclaim 15, wherein each of the shapes of the organic pattern portionoverlaps two to eight of the first pixel electrodes on a plane.
 18. Theorganic light emitting display device of claim 12, wherein the organiclayer comprises one of an electron injection layer, an electrontransporting layer, a hole injection layer, a hole transporting layer,and an organic light emitting layer.
 19. The organic light emittingdisplay device of claim 12, further comprising a second pixel electrodeon the organic layer.
 20. The organic light emitting display device ofclaim 12, further comprising a thin film encapsulation layer on theorganic layer over an entire surface of the substrate.